Wirebonding
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YouTubeNational Physical Laboratory
Wirebonding
Demonstration in NPL's Clean Room of gold deep access wedge bonding using a Delvotec 5300 series bonder. Bonding is carried out on a ceramic test chip featuring gold contact pads
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Professor Mahesh Podcast on Instagram: "How Chip Packaging Evolved: From Wire Bond to Flip-Chip In this clip, Dr. Gaurang Choksi explains the fascinating evolution of semiconductor packaging — from the earliest wire-bond technologies to today’s advanced flip-chip methods. He describes how chips with just 10–20 connections were once attached to simple lead frames using wire bonding, a technique that is still widely used in many power devices and motherboard components. But as chips demanded more
1:40
Professor Mahesh Podcast on Instagram: "How Chip Packaging Evolved: From Wire Bond to Flip-Chip In this clip, Dr. Gaurang Choksi explains the fascinating evolution of semiconductor packaging — from the earliest wire-bond technologies to today’s advanced flip-chip methods. He describes how chips with just 10–20 connections were once attached to simple lead frames using wire bonding, a technique that is still widely used in many power devices and motherboard components. But as chips demanded more
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1.8K views2 months ago
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