Abstract: This paper presents a methodology to help prevent overdesign of Electrostatic Discharge (ESD) protection circuits for internal I/O in 2.5D/3D bonding technologies. We explore how the voltage ...
Tutorials / design / Inviscid_2D_Unconstrained_NACA0012 / mesh_NACA0012_inv.su2 Cannot retrieve latest commit at this time.
Abstract: Recently, 2.5D package structure such as using silicon interposer is used for high end sever and HPC (High Performance Computing) with high density connection between logic device and memory ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results