Figure 1. Ultrasonic testing using pulse echo and through-transmission methods. Pulse echo (left and center) uses a transducer that sends and receives ultrasound energy, producing both A- and B-scan ...

Although well-accepted fracture toughness test methods are available for composite materials, the same cannot be said for sandwich composites. In fact, considerably less attention has been given to ...

Traditional IC pattern-generation methods focus on detectingdefects at gate terminals or at interconnects. Unfortunately, a significantpopulation of defects may occur within an IC's gates, or cells.

Non-destructive testing (NDT) investigates the material integrity of everything from machinery to industrial plant infrastructure to buildings but with the distinction of leaving no damage in doing so ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...