Traditional IC pattern-generation methods focus on detectingdefects at gate terminals or at interconnects. Unfortunately, a significantpopulation of defects may occur within an IC's gates, or cells.

Although well-accepted fracture toughness test methods are available for composite materials, the same cannot be said for sandwich composites. In fact, considerably less attention has been given to ...

Non-destructive testing (NDT) investigates the material integrity of everything from machinery to industrial plant infrastructure to buildings but with the distinction of leaving no damage in doing so ...