Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: In recent decades, e-learning has gained popularity alongside existing didactic concepts. The COVID-19 pandemic demonstrated the potential of web-based technologies to support higher ...
3 rd February, 2026, New Delhi: The Youth Co:Lab National Innovation Challenge 2026 was launched today, opening applications for youth-led startups across India developing innovative and practical ...
Department of Chemistry, Oregon State University, Corvallis, Oregon 97331, United States ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results