A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...

Article subjects are automatically applied from the ACS Subject Taxonomy and describe the scientific concepts and themes of the article. Glass substrates have gained considerable attention as ...

Littelfuse Inc. extends its K5V Series of illuminated tactile switches with the release of new K5V4 models including the gull-wing and 2.1-mm pin-in-paste (PIP) versions compatible with reflow ...

Littelfuse announced the expansion of its K5V Series illuminated Tactile Switch family with the release of new K5V4 models. These include Gull Wing (GH) and 2.1 mm Pin-in-Paste (PIP) versions that are ...

In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to ...

Abstract: The reflow soldering process is the key process of SMT. Available control of reflow soldering process is the important process to ensure the SMT product quality and reliability. In this ...

Phoenix Contact now offers right-angle M12 connectors for through-hole reflow (THR) soldering processes. Phoenix Contact now offers right-angle M12 connectors for through-hole reflow (THR) soldering ...

Hint: A good process might be enough. Nitrogen in reflow soldering is often seen as a performance enhancer – offering improved wetting, shinier joints and fewer defects. It’s not always necessary, ...

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the ...