“The chip combines the low latency of SRAM-first designs with the long-context support of HBM,” MatX co-founder and Chief ...

Explore the future of embedded systems development with Claude Code. Learn how AI tools could deliver high-quality code faster.

The CAFC on February 20 affirmed two final written decisions from the PTAB in inter partes review proceedings upholding claims of Netlist, Inc.’s patent.

As memory prices keep climbing, understanding AI-driven demand, US–China controls, and input costs is essential for ...

And the Coda W comes in at the same price as KEF’s more compact LSX II LT and – this is the big one – slightly less than Sonos’ flagship ARC Ultra soundbar. That should be important to those who value ...

The new parts aren't in mass production yet, but they'll likely replace most consumer RAM in the coming years.

Samsung’s 96GB 9600 MT/s LPCAMM2 module was spotted in a Lenovo post, signaling higher-capacity, high-speed memory for future laptops.

Congatec’s lineup includes five embedded board variants that support several memory standards, such as LPDDR5X, DDR5 SO-DIMM, ...

Intel has started stuffing its Panther Lake silicon into passport-sized boards for edge AI and embedded kits. At Intel Tech Tour 2025 the outfit showed off its Panther Lake modules, and now congatec ...

Samsung Electronics ⁠said ⁠on Thursday it had ⁠started shipping its most advanced HBM4 chips to unnamed ​customers, as it ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Samsung’s HBM4 module is expected to be used in Nvidia’s next-generation Vera Rubin AI accelerators. ・Nvidia reportedly plans ...