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When we talk about the cost of AI infrastructure, the focus is usually on Nvidia and GPUs -- but memory is an increasingly ...

Context graphs are emerging as a way to connect signals, actions and outcomes into a structured memory layer that preserves ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

A team at the University of California, San Diego has redesigned how RRAM operates in an effort to accelerate the execution ...

Edith Cowan University provides funding as a member of The Conversation AU. You might say you have a “bad memory” because you don’t remember what cake you had at your last birthday party or the plot ...

Memory chips are a key component of artificial intelligence data centers. The boom in AI data center construction has caused a shortage of semiconductors, which are also crucial for electronics like ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Monday - Friday, 6:00 - 7:00 PM ET CNBC's Jim Cramer on Tuesday said avoid buying Micron, Western Digital, Seagate and Sandisk after their huge runs. Instead, he pointed to semiconductor capital ...

SINGAPORE, Jan 27 (Reuters) - U.S. memory chipmaker Micron Technology (MU.O), opens new tab said on Tuesday it plans to build a $24-billion chip manufacturing plant in Singapore, as it races to boost ...