At Mobile World Congress 2026 in Barcelona, TECNO used its showcase to explore a practical question facing the smartphone industry: how to deliver more on-device AI processing without making ...

What if the smartest part of a product is not the product itself but the tiny subsystem quietly making decisions and talking back? Designing the future ...

Learn how to integrate HSMs for Post-Quantum Key Encapsulation in MCP environments. Protect AI infrastructure with ML-KEM and quantum-resistant hardware.

Is it time for modular phones again? TECNO thinks its magnetic snap-on hardware concept could finally make it work.

From Agentic AI and Privacy Display to 200MP camera, Snapdragon Elite Gen 5, and 5,000mAh battery, here’s our early verdict.

As urban centers grapple with escalating traffic congestion and the limitations of traditional two-dimensional road networks, the concept of the split flying car has emerged as a transformative ...

It looks like a cute little dolphin-themed toy, but the Flipper Zero is a surprisingly powerful learning tool for hacking.

The first Micron GDDR7 memory chips have been spotted on NVIDIA GeForce RTX 50-series GPUs, indicating Micron is now ...

The Xiaomi 17 Ultra Leica Edition gets a launch date in global markets as the Leica Leitzphone powered by Xiaomi.

TECNO unveils the world’s thinnest modular smartphone concept at MWC 2026, featuring magnetic snap-on modules, a 4.9mm base ...

Prefabricated modular datacentres have changed considerably from their origins as containerised stopgaps. Today’s solutions are sophisticated, enterprise-grade infrastructure systems, ...