In industrial plants around the world, tiny bubbles cause big problems. Bubbles clog filters, disrupt chemical reactions, reduce throughput during biomanufacturing, and can even cause overheating in ...

When Elise Felicione tried to design a clinical trial for a supplement, 5 things got in the way. It’s a lesson for the ...

In the age of AI, the scarcest resource in headquarters is no longer time. It is, rather, the willingness to say no. Artificial intelligence is moving ...

Designing and deploying DSPs FPGAs aren’t the only programmable hardware option, or the only option challenged by AI. While AI makes it easier to design DSPs, there are rising complexities due to the ...

Learn about agentic design automation, which Mark Ren, CEO of Agentrys and DesignCon keynote speaker, says will lead us into ...

Today's oil and gas engineers are innovating with materials and surface technologies to enhance equipment reliability and ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Improving density in circuit design is an ongoing challenge. One solution is to reconsider circuit layouts from the perspective of bandwidth optimization.

The semiconductor industry has been applying AI to accelerate chip design for over three years, achieving 10X productivity gains and focusing primarily on tasks that now seem relatively easy, such as ...

ABSTRACT: Multi-objective optimization remains a significant and realistic problem in engineering. A trade-off among conflicting objectives subject to equality and inequality constraints is known as ...