Abstract: In this article, a large-scale electromagnetic-thermal-mechanical co-simulation solver is implemented, to simulate complex radio frequency components by using a high performance computing ...
Simulating the full multi-physical phenomena involved in microwave-induced thermoacoustic imaging (MITAI) establishes a foundation for applying MITAI in clinical settings.
Abstract: In this article, reliability analysis of 3D CSP micro-electro mechanical system (MEMS) and IC under thermal cycle-impact coupled multiphysics loads was investigated. COMSOL Multiphysics, a ...
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