This project implements a cross-platform tool for focus stacking images. The application takes a set of images captured at different focus distances and combines them so that the complete subject is ...
Abstract: 3D Multi-stacking technology using Cu-Cu hybrid wafer bonding has been developed to achieve superior power, speed performances and higher density with minimized form factor. To realize multi ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results