Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
Abstract: In this article, a large-scale electromagnetic-thermal-mechanical co-simulation solver is implemented, to simulate complex radio frequency components by using a high performance computing ...
This is the primary documentation for the MoveIt project. We strongly encourage you to help improve MoveIt's documentation. Please consider helping improve the tutorials, port old ones from ROS 1, and ...
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