Kotaku

Snow Plow Train Simulator 3D – Russia

All the Latest Game Footage and Images from Snow Plow Train Simulator 3D – Russia Your mission is to clear snowdrifts in one of the trainlines in Russia. Drive through Siberian lands and clear the ...
IEEE

A Thermal and System Analysis of SoC-Memory 3D Stacking using Massive Orthogonal Stacking Assembly

Abstract: A novel chip stacking method with low thermal resistance for 3D integration of a large number of memory chips and processor chips is proposed, namely Massive Orthogonal Stacking Assembly of ...
IEEE

Concrete Spray 3D Printing Simulator for Nozzle Trajectory Planning

Abstract: Existing 3D printing simulators target extrusion-based methods, which cannot be directly applied to spray-based methods. This letter presents a new computational method for simulating ...
Business Wire

Kioxia Develops Core Technology that Will Allow the Practical Implementation of High-density, Low-power 3D DRAM

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the ...
cmu.edu

New CMU 3D-Printing Simulator Constructs Stronger, More Efficient Concrete Buildings

When natural disaster strikes, a building’s survival often depends on how it’s built. Engineers at Carnegie Mellon University have created a fast, highly accurate simulator for spray-based concrete 3D ...
EDN

Mastering multi-physics effects in 3D IC design

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...
Bloomberg L.P.

Advanced Semiconductor Packaging Market Could Reach $80 Billion by 2033 as AI Chips Spread to Consumer Devices, According to Bloomberg Intelligence

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...
Semiconductor Engineering

How 3D-IC Will Change Chip Design

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
Semiconductor Engineering

First Forays Into True 3D-IC Designs

Experts at the Table: Semiconductor Engineering sat down to discuss initial forays into 3D-ICs and what problems early adopters will encounter, with John Ferguson, senior director of product ...
Nasdaq

Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...