The E-2D supports a wide variety of missions: defensive and offensive counter-air, integrated air and missile defense, electronic warfare, air traffic control, combat search and rescue, humanitarian ...

Abstract: Ultrasound (US) neuromodulation and ultrasonic power transfer to implanted devices demand novel ultrasound transmitters capable of steering focused ultrasound waves in 3D with high spatial ...

Threat actors have been exploiting a command injection vulnerability in Array AG Series VPN devices to plant webshells and create rogue users. Array Networks fixed the vulnerability in a May security ...

The global integrated circuit (IC) industry is confronting the physical limitations of Moore's Law. Atomic-layer-thick two-dimensional (2D) semiconductors, such as Molybdenum Disulfide (MoS2), are ...

Arrays for 'slow and wide' interconnections enable power-efficient and compact short reach links Coherent has announced what is claims is a breakthrough in short-reach optical interconnect technology ...

SAXONBURG, Pa., Sept. 18, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced the development of a high-precision molded 2D lens array leveraging its ...

When you see the name Bentley, you probably think of the British luxury car manufacturer. But there's another Bentley making waves, in a very different way. Bentley Systems is a company that develops ...

Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising alternatives to the conventional silicon-based semiconductors currently used ...

OZ Optics Limited, a recognized leader in high-performance optical fiber components and subsystem module assemblies, is excited to announce the launch of its new line of 2D-Fiber Array (FA) assemblies ...

Coherent Corp. has announced the launch of its 2D Collimator Array, an innovative optical assembly designed for use in optical circuit switches (OCS), which are increasingly vital for advanced data ...

A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...