Below 28 nm, maximum device length limitations mean that analog designers often need to connect multiple short-length MOSFETs in series to create long-channel devices. These series-connected devices ...
Across The Vast Reaches Of The 3D Stack: Mastering ESD Verification In Advanced Semiconductor Design
In the vast reaches of the semiconductor cosmos, a silent menace lurks—one that can obliterate years of design work in a fraction of a nanosecond. Electrostatic discharge (ESD) verification stands as ...
Why stack allocation is a good idea for embedded programming. Myths about stack allocation. I started my programming career using BASIC and assembler on computers that had very limited support for a ...
A group of scientists from the German research institute Fraunhofer Umsicht claims to have reduced the production costs of redox flow batteries by redesigning one of its main components – the stack.
January 10, 2024 -- Global Unichip Corporation (GUC), a leading global ASIC provider, has successfully taped out a complex 3D stacked die design on an advanced FinFET node process. The design, which ...
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