OMRON Electronic Components today announced a collaboration with KS Technologies (KST) to develop an add-on Long Range (LoRa) communication module for its Weather Sensor, bringing low-cost data ...
Arduino has just announced the Arduino Matter Discovery Bundle (AKX00081), an all-in-one development kit designed to help ...
Teledyne FLIR OEM has designed its Lepton XDS compact thermal and visible camera for space- and power-constrained products.
Dual-sensor design combines radiometric thermal, 5MP visible, and on-board ISP to speed OEM integration across industrial and mobile platforms.
Multimodal sensing in physical AI (PAI), sometimes called embodied AI, is the ability for AI to fuse diverse sensory inputs, ...
Teledyne FLIR OEM introduces the Lepton XDS, a compact dual thermal-visible camera module featuring MSX technology and Prism ISP.
Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated (NYSE:TDY), today announced the launch of the Lepton® XDS, a ...
Digital Camera World on MSN
What's better than one 200MP sensor in a camera phone? Two of them!
Rumors suggest there could be several phones on the way with multiple 200MP camera modules ...
What is the Market Size of MEMS Packaging? The global MEMS Packaging market is projected to grow from USD 48080 Million in ...
Samsung's rumored 200MP ISOCELL HPC sensor promises larger 1/1.3-inch size, UFCC tech, and ultra-high dynamic range for next-gen flagship smartphones.
A flexible foam sensor built from silver selenide detects temperature and pressure simultaneously, enabling a robotic gripper ...
Oppo is gradually revealing new details about its upcoming foldable flagship, the Oppo Find N6, as anticipation builds ahead of its expected debut in China. In a recent Weibo post, a company executive ...
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