Graphic Packaging Holding Company (GPK) 47th Annual Raymond James Institutional Investor Conference March 4, 2026 9:50 AM ESTCompany ...
Abstract: In paralleled silicon carbide (SiC) power semiconductor devices, packaging layout and current sharing have a direct impact on thermal stress distribution and device reliability. This paper ...
Abstract: Decomposition has been the mainstream approach in the classic mathematical programming for multi-objective optimization and multi-criterion decision-making. However, it was not properly ...
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