Teledyne FLIR OEM has designed its Lepton XDS compact thermal and visible camera for space- and power-constrained products.

A cost-optimized 5G RedCap module delivering high throughput, precise positioning, and scalable global connectivity for ...

Iridium Communications has just unveiled the Iridium 9604 3-in-1 IoT module with support for Iridium Short Burst Data (SBD) ...

Explore the future of embedded systems development with Claude Code. Learn how AI tools could deliver high-quality code faster.

Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated (NYSE:TDY), today announced the launch of the Lepton® XDS, a ...

A practical evaluation of using AI‑assisted coding to construct a TUI framework for the Ring programming language This ...

Dual-sensor design combines radiometric thermal, 5MP visible, and on-board ISP to speed OEM integration across industrial and mobile platforms.

Nexcom APPC 160/210 C21 panel PCs Unleashing the Ingenuity of SD Edge Computing with AIoT and AI Computing products New ...

Veea SecureConnect represents a next-generation approach to delivering ultra-reliable 5G-based fixed wireless access integrated with enterprise-grade AI-driven cybersecurity and value-added services ...

Ericsson has highlighted a number of innovations ahead of MWC – with collaborations from Ookla, Apple, MediaTek, Swisscom, ...

Managing Editor Paige Hookway picks her top 5 AI products to be announced in February 2026. New industrial motherboard from Kontron. Kontron introduces the K4131-Px, a powerful mI ...

Nigeria has secured major legal victory in an international arbitration dispute involving UK-based technology contractor European ...