Abstract: In a chiplet design, several dies are integrated through die-to-die interconnects. Technical challenges still exist when it comes to the repair of faulty die-to-die interconnects to boost ...
Abstract: A wafer to wafer hybrid bonding technology is realized featuring a hybrid interconnect pitch scaling down to 300 nm. Integration challenges and optimizations are extensively discussed. High ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results