High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Abstract: Containers have been commonly used in recent years for application deployment in many fields of computing, including the Internet of Things (IoT). Thus, there is an opportunity for the use ...
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