New Electronics

NanoIC releases first PDKs for fine‑pitch RDL and hybrid bonding interconnects

To help designers experiment with these architectures, NanoIC has released the first versions of its fine‑pitch RDL and D2W ...
Silicon Semiconductor

NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs

New advanced interconnect PDKs pave the way for high density, energy efficient chip to chip integration.
PCMag on MSN

With GPT-5.4, OpenAI Promises Fewer Errors, Preps for Autonomous Agents

This week's second new model from OpenAI is built for more complex tasks than GPT-5.3 Instant.
Silicon Semiconductor

Particle accelerator technology promises exciting future for lithography

Jerome Paye, CEO of TAU Systems, outlines how the company’s compact free-electron laser technology addresses the semiconductor industry's most pressing bottleneck, manufacturing ever smaller, more ...