While searching for new products on AliExpress, I came across the SayoDevice OSU O3C, which looks very similar to other macro ...
A panel of industry experts takes a sneak peek at system-level design challenges in EVs and outlines viable solutions.
NEXCOM heads to Embedded World 2026 in Nuremberg next week with a lineup spanning AI-edge computing, robotics, and smart city platforms. The centerpiece is the APPC C21-01 series. These fanless panel ...
Abstract: The integration of magnetic components within printed circuit boards (PCBs) offers an innovative pathway to enhance electromagnetic performance while reducing size and improving ...
Abstract: The linear variable reluctance (VR) resolver as a contactless measurement component is essentially a small electric machine and presents a better reliability than other linear position ...
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