Abstract: A novel “Cool 3D chiplet” concept is proposed, showcasing remarkable heat dissipation through the integration of aluminum nitride (AlN), an insulating material with high thermal conductivity ...
Abstract: This paper presents a methodology to help prevent overdesign of Electrostatic Discharge (ESD) protection circuits for internal I/O in 2.5D/3D bonding technologies. We explore how the voltage ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results