Abstract: The conventional packaging technique, especially the aluminum bond wire, limits the high-temperature resistance of SiC-based power devices. This study adopts the DSC (Double-sided Cooling) ...
This tool has been developed using both LM Studio and Ollama as LLM providers. The idea behind using a local LLM, like Google's Gemma-3 1B, is data privacy and low cost. In addition, with a good LLM a ...
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