Abstract: Among advanced packaging technology for heterogeneous chips, die-embedded packaging technology is expected for the minimization of packaging substrate thickness through integration of a ...

Modern batch processing relies on flexible ISA-88–based software that streamlines recipe creation, coordinates tasks across multiple units and enables efficient execution of multistage production ...

Introduction Intensive care unit (ICU) visiting restrictions in hospitals, implemented due to infection control and other factors, limited contact between patients and family members, affecting ...

Abstract: Novel temporary bonding/debonding system including high heat resistant temporary bonding adhesive and debonding methods with newly developed photonic release by Xe flash light irradiation ...