HyperNova 60B 2602, a 50% compressed version of OpenAI’s gpt-oss-120B, accelerates Multiverse’s plans to deliver hyper-efficient, high-performance models for free to developersDONOSTIA, Spain, Feb. 24 ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Traumatic injury is the third leading cause of death in the state of Texas, surpassing strokes, Alzheimer's disease and diabetes, according to the Centers for Disease Control and Prevention. A massive ...

Chinese humanoid robot companies are pulling in hundreds of millions of dollars from investors, some of it traceable to ...

Brain tumors do not just invade healthy tissue. They also physically squeeze it, and that mechanical compression may be enough to trigger neuron death in the surrounding brain. Two peer-reviewed ...

This marks the second major exhibition in 15 years to comprehensively showcase Taiwanese contemporary art at the Ludwig ...

Shrinking ferroelectric tunnel junctions can significantly boost their performance in memory devices, as reported by ...

There's a bottleneck in the AI boom that won't be solved anytime soon. AI workloads require immense amounts of dynamic random access memory (DRAM), high-bandwidth memory (HBM), and "NOT AND" (NAND) ...

SoftBank unit Saimemory and Intel team up on new memory tech aimed at AI and high-performance computing. Prototypes are planned for 2028, with commercialization targeted for fiscal 2029. Energy ...

Samsung Electronics plans to start production of ‍its next-generation high-bandwidth memory (HBM) chips, or HBM4, next month and supply them to Nvidia, a person ‌familiar with the matter told Reuters ...

Samsung Electronics is reportedly closing in on a critical milestone in the intensifying artificial intelligence (AI) memory chip market. The South Korean tech giant is nearing certification from ...