The industry’s response is to split compute, memory, and I/O across dies, XPU chiplets are pushing toward the reticle limit, and stitch it all together with high‑bandwidth, energy‑efficient die‑to‑die ...
Panelists repeatedly highlighted that AI compute scaling is dramatically outpacing traditional Moore’s Law transistor ...
Advances in machine learning and shape-memory polymers are enabling engineers to design for mechanical performance first and ...
A study shows how high-thermal dielectrics outperform FR-4 for bulk heat spreading, with surface-mount thermal bridges ...
While ultra HDI may receive considerable attention for stacked vias, staggered vias are a smart choice in many designs. The structure, offsetting each microvia, permits the dielectric to absorb ...
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