BROOKLYN, NY – IEH Corporation reported a record order backlog exceeding $23 million as rising demand for defense systems increases orders for its Hyperboloid connectors and interconnect assemblies.
Panasonic Industry Co., Ltd. will invest approximately 7.5 billion yen into Panasonic Industrial Devices Materials (Guangzhou) Co., Ltd. (Guangzhou Factory), to add an additional production line ...
Freudenstadt, Germany, March 04, 2026 – SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) applications with ...
A study shows how high-thermal dielectrics outperform FR-4 for bulk heat spreading, with surface-mount thermal bridges ...
A recent exchange on LinkedIn about the EMS industry got me thinking about the many good, bad and ugly NPI processes I have ...
A Ghost Queue forms when a shop’s administrative (and production) capacity to accept orders outpaces its physical capacity to ...
Siemens today announced Inventec Corporation, a global leader in high-tech electronics and server manufacturing, has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the ...
How fully has AI taken over packaging, power and manufacturing priorities? With more than 92,000 visitors and 1,850 ...
TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with ...
The EIPC Winter Conference in February was revealing for several reasons, not the least of which was that the view among the 125 primarily European electronics engineers and executives in attendance ...
In medical technology, and beyond, responsible innovation that benefits us all lies not in unchecked adoption, but in thoughtful advancement. By recognizing past missteps and proactively addressing ...
While ultra HDI may receive considerable attention for stacked vias, staggered vias are a smart choice in many designs. The structure, offsetting each microvia, permits the dielectric to absorb ...
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