Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Motorola Inc.’s semiconductor products sector (SPS) today said it has developed and qualified the first wafer level burn-in and test (WLBT) process for flip-chip microprocessors. Motorola aims to ...

In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...

FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order from a ...

Keeping an IC cool takes on new meaning when power dissipation exceeds 150 watts. Innovative electrical and mechanical solutions to new wafer testing challenges continue to be developed. For example, ...

FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...

I’ve had a fairly varied early part of my career in the semiconductors business: a series of events caused me to jump disciplines a little bit, and after one such event, I landed in the test ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...