The post NVIDIA Could Beat Apple to TSMC's Most Advanced Chip Process, and It's Not Even Close to Ready appeared first on Android Headlines.

According to industry sources, TSMC is planning to introduce a 12 nanometer half-node process to enhance competition with 28nm and lower process nodes that have been adopted over the past few years.

Accelerates Pathway to Ultra High-Speed 1.6Tbps Bandwidth for Build Out of the Next Generation of Cloud Computing, AI, and Hyperscale Networks SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology ...

ROHM Co., Ltd. (hereinafter “ROHM”) today announced it has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC, with which ...

A new report suggests TSMC’s 2nm process may bring smaller-than-expected gains in power, performance, and area despite its next-gen branding. If true, the reduced complexity could keep wafer pricing ...

Supply chain chatter around Apple’s next-generation iPhone lineup has intensified, with recent leaks pointing to both an iPhone 18 Pro and a long-anticipated foldable iPhone moving closer to mass ...

The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...

TL;DR: Apple's upcoming M5 processor will be manufactured using TSMC's cost-effective 3nm N3E process, competing with Qualcomm and MediaTek's chips on the higher-end N3P node. The more advanced M5 Pro ...

LAWRENCEVILLE, Ga.--(BUSINESS WIRE)--Silicon Creations, a leading provider of precision IP for advanced SoC design, today announced its 1000th production FinFET tapeout at TSMC, alongside the ...

The new 224G PAM4 IP offering brings Credo’s high-performance, power-efficient SerDes technologies with fabrication on an industry-leading advanced process technology from TSMC to provide the ...