Printed Circuit Design & Fab Online Magazine

Rethinking the basics of PCB and IC Substrate manufacturing with mSAP

SAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...
Morningstar

Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM (TM) Series," Its First Successful Formation of 3-layer RDL with CD 1.6 Micrometers on 12-inch Wafer

- Paper Presented at 14th IEEE CPMT Symposium Japan (ICSJ 2025) - TOKYO, Nov. 13, 2025 /PRNewswire/ -- On November 13, 2025, Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as ...
Seeking Alpha

SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment

FREUDENSTADT, Germany, Nov. 10, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (SHMD), a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing, today ...