The process control and instrumentation minor emphasizes developing skills and knowledge in theory, software and in the field. Students graduate ready to solve complex control problems in the chemical ...

Hot forging processes remain a cornerstone of modern manufacturing, yet they present significant challenges due to the elevated temperatures and complex geometries involved. Recent advances in ...

Process capability indices (PCIs) have long served as crucial metrics in assessing the performance and quality of manufacturing processes. Recent advances in statistical estimation techniques have not ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

There is a boom in the volume of semiconductor devices being manufactured, and the boom is primarily credited to the proliferation of Internet of Things (IoT)-based devices in our daily lives. IoT ...

The lower fuselage half of the Multifunctional Fuselage Demonstrator (MFFD) being assembled at SAM|XL, shown here with conduction-welded stringers and ultrasonic spot-welded clips. Photo Credit: ...