There is considerable ongoing discussion on how to contain exponentially increasing test costs for systems-on-chip (SoCs) and microprocessors. As the transistor geometry shrinks and more transistors ...
Testing multiple devices at the same time is not providing the equivalent reduction in overall test time due to a combination of test execution issues, the complexity of the devices being tested, and ...
Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory ...
SAN FRANCISCO — During the Semicon West trade show, Agilent, Credence and Electroglas separately rolled out automatic test equipment (ATE) solutions to attack chip-testing costs. Electroglas Inc.
Developing an automated production test solution for current and next-generation complex RF SIP/SOC devices is an increasingly difficult task. Both the test program and the device interface board (DIB ...
SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...
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