The semiconductor industry faces enormous challenges in virtually every field. Thanks to a recent advance in interconnect technology from Applied Materials, we should manage to squeeze a few more ...

Although multi-die designs — an increasingly popular approach for integrating heterogeneous and homogenous dies into a single package — help resolve problems related to chip manufacturing and yield, ...

The “Era of AI” is here, transforming how we work and live, but it’s pushing data centers to their limits. Training large language models (LLMs) demands massive volumes of computing and memory, ...