An integrated circuit at 0.25-micron design rules contains about 800 meters of wire interconnect, draining 50 percent of the power consumed by the circuit. When 0.01-micron chips emerge, they will ...

Digital integrated circuit interconnects have characteristics that must be considered as an integral part of the design process. SoC designers can't be fully decoupled from the manufacturing process.

Moving data around is probably the least interesting aspect of system design, but it is one of three legs that defines the key performance indicators (KPI) for a system. Computation, memory, and ...

The semiconductor industry faces enormous challenges in virtually every field. Thanks to a recent advance in interconnect technology from Applied Materials, we should manage to squeeze a few more ...

Interconnects are becoming increasingly challenging to design, implement and test as the amount of data skyrockets and the ability to move that data through denser arrays of compute elements and ...

Applied Materials rolled out a semiconductor fab tool this month that gives its a new way to engineer copper interconnects in advanced logic chips, solving a stumbling block to future 3-nanometer ...