HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...
A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...
Applied Materials Inc. today announced Reflexion LK, what it said is the industry's only low down force chemical mechanical polishing (CMP) system that planarizes low k and ultra-low k dielectric ...
Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...
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