At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...

As a seasoned tester, the responsibilities in defect management extend beyond the routine tasks of reporting issues and verifying resolutions. While these ...

Ministry of Testing is where software testing and quality engineering professionals grow their careers. Reach new heights ...

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Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Charlotte, N.C. — The IC design community has begun to question its goal of achieving fewer than 100 defective parts per million. Citing the difficulty and costs associated with the stringent ...