The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...
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How are QA teams using machine learning to predict test failures in real time?
QA teams now use machine learning to analyze past test data and code changes to predict which tests will fail before they run. The technology examines patterns from previous test runs, code commits, ...
Synopsys chose the International Test Conference to highlight two significant initiatives: defect-detection enhancements in TetraMAX ATPG through slack-based cell-aware test capability, and a new STAR ...
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